It is reported that three respectively from the College of Polymer Science and Engineering, Jeonnam University, Kwangju University, the three South Korean university researchers to develop a thermally stable silver-based conductive 3D printing wire. Their research, just published in Advanced Materials magazine, could have a significant impact on 3D printing of integrated electronic components.
In the electronics manufacturing industry, conductive 3D printing makes it easy to customize parts by minimizing the amount of conductive fillers. In this study, South Korean researchers developed a 3D printed wire with less than 3% by weight of preconductive filler by forming a silver-organic composite (SOC). The use of a chelating agent allows the SOC to have thermal stability (TS), and thermal degradation is minimized to 0.91% (weight ratio), even at high temperatures as well as 3D printing by the cage effect.
In addition, the researchers also directly designed a compact extruder with a short (3cm) heating phase. It is used to make wires based on TS-SOC to minimize thermal degradation. In addition, silver nanoparticles (SNPs) with a diameter of 70 to 90 nm are uniformly formed and densified conductive percolation networks are formed by releasing the chelating reaction and chemical reduction of the surface. Finally, not only electrical characteristics up to 55.71 S cm-1 were obtained, but internal short-circuits due to plugging problems with conventional conductive wires can also be overcome.
This TS-SOC-based, thermally stable conductive wire enables continuous 3D printing. This method is cost-effective by using the least amount of filler, and makes it possible to produce custom 3D electrodes using organic silver nanoparticles.
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