Electroformed bond: The Hub Blade mix metal nickel bond and diamod by electroforming method, the bond have the strong abrasion and high life.
Diamond Dicing Tools:The Hub Blade cut materrial by the sharp diamond, The diamond cutting have the high efficiency and quality in man applications.
The Silicon Wafer Dicing Blades: The Hub Nickel Dicing Blade can be widely used in Silicon wafer Dicing, Silicon wafer Dicing require the narrow kerf and less chipping, with the fine diamond and ultra-thin, the blade can satisfy the cutting requirements.
*Both can High-speed Dicing.
The Hub Nickel Dicing Blade
The Silicon Wafer Dicing Blades,Diamond Dicing Tools,The Hub Blade,Dicing Saw for for Cutting Glass,High-speed Dicing
Suzhou Sail Science & Technology Co., Ltd. , http://www.sail-abrasives.com
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